Organic Packages / Printed Wiring Boards

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Organic Package

Build-up Structure FC-BGA
FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.
SHDBU Structure Type
Kyocera recommends SHDBU substrates for high-speed with high I/O count flip chip BGA. SHDBU substrates have high-density build-up and CPCORE as a core material, which allows for a finer design rule than with conventional core materials making them thin and displaying good characteristics for high speed applications.
In addition to fine geometry routing at the build-up layer, routing in CPCORE is possible, so it is a suitable technology for full area array flip chip assembly and MCM. Furthermore, critical routing is possible in the CPCORE layer, and is suitable for high speed switching devices and high speed routers.
CPCORE Structure Type
CPCORE processes features of both multilayer ceramic technology and multilayer organic technology, and complies with 175µm via pitch routing and all layer stacked via.
CPCORE material is flexible in routing design, which contributes to the enhancement of electrical performance. CPCORE is suitable for semiconductor packages where high speed signal transmission is required.
FC-CSP Substrates
In recent years, IC packages have become necessary to meet the market needs of small and thin substrates required for digital handset equipment.
Kyocera has been enhancing and improving SLC technologies to respond to the market demand for thin and small substrates.

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