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Organic Packages / Printed Wiring Boards

Japanese site

Development Flow Chart

We conduct total coordination for customers and provide them with optimal solutions together with our development partner companies

・We can also procure parts for our customers.
・Actual boards are evaluated by a third party, our development partner. Based on their evaluation, we can obtain objective and reliable evaluation results.
・We ensure smooth transition of production to mass-production of boards as our board plant can handle such operation.

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Organic Package
Build-up Structure FC-BGA
FC-CSP Substrates
Module Substates
Thin Type Module Substrates
Printed Wiring Boards
AnyLayer PWBs
Board Design
Simulation
Transmission Line Simulation
Power Supply Noise Simulation
EMI / ESD / Thermal Simulation
One-stop Solution
Development Flow Chart
List of Technologies We Can Handle
Case Example
Inquiry
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