Organic Packages / Printed Wiring Boards

Build-up Structure FC-BGA

FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

Features

Leaders-in circuitization rule as line/space: 9µm/12µm
Advanced small via formation with laser via technology
Highly reliable thermosetting epoxy used
Various surface finish options available (Ni/Au, SAC soldering, etc.)
Applicable environmentally-friendly products (Halogen-free, Lead-free)

Specifications

Item	Specification	Note
Layer Structure	Up to 10-n-10	Max layer count
Build-up Line Width / Space	9μm / 12μm	Min.
Via Land Diameter	85μm	Min.
Core Line Width (Subtractive)	30μm	Min.
Core Space (Subtractive)	45μm	Min.
Flip Chip Pitch	100μm	Min.

Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.

Please feel free to contact us for further information.

Applications

ASICs for servers / routers
MPUs for high performance game consoles
Graphics processors, etc.

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