FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.
|Layer Structure||Up to 9-n-9|
|Build-up Line Width / Space||9μm / 12μm|
|Via Land Diameter||85μm|
|Core Line Width (Subtractive)||30μm|
|Core Space (Subtractive)||40μm|
|Flip Chip Pitch||125μm|
Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.
Please feel free to contact us for further information.