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Organic Packages / Printed Wiring Boards
Simulation
We possess a variety of simulation techniques to help our customers solve their design problems
We apply a variety of simulation techniques, ranging from review of design specifications and evaluation of developed equipment, to solutions for tasks and problems related to board performance, thereby providing wide-ranging support to customers in their product development.
We identify problems in the design stage and propose optimization through verification of signal integrity including analysis of electric parameters to ensure matching of characteristic impedance, modeling of connector components, and coordinated design including LSI packages or chips.
Since we can determine and cope with impacts of IR drop (voltage drop) that occurs in resistance components of the board, power source impedance characteristics, or simultaneous switching noise in the design stage, we are able to develop highly reliable products. Such power source noise increases jitters in high-speed signals, degrades the reliability of signal waveforms and further leads to generation of common mode radiation noise. Reduction in power source noise is effective in improving the electric characteristics of a system. We can support reliable product design through our long experience in board design development for various fields.
In general, it is difficult to identify the causes of and formulate counter measures for electromagnetic Interference (EMI) in an actual device. We optimize the placement/wiring and return path of power through differential mode emission analysis and common mode emission analysis at the design stage in order to minimize EMI. We also manage analysis of electrostatic discharge (ESD) and thermal analysis. Kyocera’s expertise in board characteristics is the base of our original design support service.
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