FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.
|Layer Structure||Up to 10-n-10||Max layer count|
|Build-up Line Width / Space||9μm / 12μm||Min.|
|Via Land Diameter||85μm||Min.|
|Core Line Width (Subtractive)||30μm||Min.|
|Core Space (Subtractive)||45μm||Min.|
|Flip Chip Pitch||100μm||Min.|
Specifications are subject to change without notice due to continual improvements in materials and manufacturing processes.
Please feel free to contact us for further information.