Ceramic packages possess features such as high Young's modulus of elasticity, low coefficient of thermal expansion, high thermal conductivity, high heat resistance, zero water absorption, and high design flexibility.
Taking advantage of such characteristics, Kyocera provides ceramic packages and lids (metal, glass, silicon, etc.) for a variety of automotive sensor applications.
Silicon Lid and Ceramic Package
for Infrared Sensors
for CCD/CMOS Cameras
Ceramic Package for EGR
Differential Pressure Sensors
Dual-Cavity Ceramic Packages
for Inertial Combo Sensors
for Combustion Pressure Sensor Amplifiers
for Automatic Transmission Oil Pressure Sensors
Ceramic Packages for MEMS Gyroscopes and Accelerometers
Copyright Analog Devices, Inc. All rights reserved
Ceramic Packages for Tire Pressure Sensors
Courtesy of Texas Instruments Japan Limited