Ceramic Packages

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SEMICONDUCTOR COMPONENTS

Kyocera provides custom designed ceramic packages and components to meet specific customer requirements. Standard (open tool) products are also available for device evaluation and low volume orders.
Standard Packages and Lids for Device Evaluation


 Product Categories
Surface Mount Ceramic Packages for Electronic Devices
Surface Mount Ceramic Packages for Electronic Devices
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  Ceramic Packages for MEMS Sensors
Ceramic Packages for MEMS Sensors
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Ceramic Packages and Optics for Image Sensors
Ceramic Packages and Optical Filters for Image Sensors
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  Ceramic Packages for Light Emitting Diodes (LEDs)
Ceramic Packages for Light Emitting Diodes (LEDs)
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Ceramic Packages for Automotive Electronics
Ceramic Packages for
Automotive Electronics
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  Ceramic Packages for Power Electronics
Ceramic Packages for
Power Electronics
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Ceramic Packages for Large Scale Integration (LSI) Devices
Ceramic Packages for Large Scale Integration (LSI) Devices
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  Components for Fiber-Optic Communication Modules
Components for Fiber-Optic Communication Modules
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Components for Wireless Communication Devices
Components for Wireless Communication Devices
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  Components for Fiber-Optic Connectors
Components for Fiber-Optic Connectors
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LTCC Packages for RF Modules
LTCC Packages for RF Modules
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  Ceramic Substrates for Probe Cards
Ceramic Substrates for
Probe Cards
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Standard Packages and Lids for Device Evaluation
Standard Packages and Lids for Device Evaluation
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  Glass Hermetic Feedthroughs
Glass Hermetic Feedthroughs
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Organic Materials
   
 
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