Ceramic Packages

Surface Mount Ceramic Packages for Electronic Devices

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Kyocera also supplies frit-seal ceramic lids and solder-seal metal lids. Custom and standard designs are available.

SAW: Surface Acoustic Wave; RF: Radio Frequency; MEMS: Micro-Electro-Mechanical Systems

General Applications

Crystal Units, Crystal Oscillators, SAW Filters, Duplexers, and MEMS Devices (Accelerometers, Gyroscopes, Pressure Sensors, Magnetic Sensors, Infrared Sensors, Micro Mirror Arrays, Silicon Microphones, Silicon Oscillators, RF MEMS Switches, etc.)

Application Examples

  • MEMS Accelerometers
    Copyright Analog Devices, Inc.
    All rights reserved.

  • MEMS Gyroscopes
    Copyright Analog Devices, Inc.
    All rights reserved.

High Strength Alumina: AO700

This alumina (Al2O3) ceramic material has a flexural strength (620MPa) approximately 1.5 times higher than conventional alumina ceramics (400MPa). It is suitable for small packages, including 2520 (2.5mm x 2.0mm) size and smaller.

Material Properties

Top of page