Flip Chip HITCE LTCC BGA Package
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Kyocera provides both ceramic and organic packages for Large Scale Integration (LSI) devices. In addition to alumina (Al2O3) ceramics, we produce aluminum nitride (AlN) with high thermal conductivity (150W/mK), as well as Low Temperature Co-Fired Ceramic (LTCC) packages with high (12.3ppm/K) and low (3.4ppm/K) coefficients of thermal expansion.
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 Technologies for High Speed Devices |
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| Flip Chip BGA |
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| High Second Level Reliability |
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| Kyocera’s HITCE LTCC material offers a coefficient of thermal expansion (CTE) close to that of printed circuit boards, providing high reliability in board assembly. |
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·CTE: 12.3ppm/K (R.T. to 400oC)
·Young's Modulus of Elasticity: 74GPa |
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Second Level Reliability Test Samples
Ceramic Package
Configuration: BGA (1.27mm pitch)
Materials: Alumina (Al2O3), HITCE LTCC
Outer Dimension: 33mmSQ
Thickness: 1.2mm and 1.8mm
Motherboard
Material: FR-4 (CTE:15ppm/K)
Outer Dimension: 65mmSQ
Thickness: 1.6mm |
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