Ceramic Packages

Ceramic Packages for Power Electronics

Kyocera provides power electronics packages by using ceramic-to-metal bonding technologies.

Copper-Bonded Silicon Nitride Packages

  • Silicon nitride ceramic substrates
    SN460: flexural strength: 850MPa; fracture toughness: 5.0MPam1/2; thermal conductivity: 58W/mK
    SN490: flexural strength: 820MPa; fracture toughness: 6.3MPam1/2; thermal conductivity: 85W/mK
  • Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method. Upper layer circuits are connected to lower ones by buried copper vias.
  • High reliability: Hermeticity confirmed after 1000 cycles (-65°C to +150°C) of temperature cycling test (sample: five pieces; Kyocera test results)

Copper-Bonded Silicon Nitride Substrates

  • Silicon nitride ceramic substrates
    SN460: flexural strength: 850MPa; fracture toughness: 5.0MPam1/2; thermal conductivity: 58W/mK
    SN490: flexural strength: 820MPa; fracture toughness: 6.3MPam1/2; thermal conductivity: 85W/mK
  • Copper plates and silicon nitride ceramic substrates are bonded by active metal bonding method
  • High reliability: Insulation resistance and dielectric withstand voltage confirmed after 5000 cycles (-60°C to +175°C) of temperature cycling test (sample: five pieces; Kyocera test results)

TO-254 / TO-257 Ceramic Packages

  • Copper-core pins and metal heat sinks are bonded onto multilayer alumina ceramic packages
  • High reliability: Hermeticity and dielectric withstand voltage confirmed after 1000 cycles (-65°C to +175°C) of temperature cycling test (sample: ten pieces; Kyocera test results)

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