Ceramic Packages

Features

• 100 micron via, line width and pattern gap possible for high density design
• High temperature durability suitable for "In-Transmission" harsh environments
• Ceramic's high thermal conductivity provides excellent heat dissipation
• Thermal expansion matching allows high reliability in bare-chip assembly to the board
• Available with printed resistors on the back side of the substrate

Applications

• ECUs for fuel injection
• ECUs for automatic transmissions
• ECUs for electronic power steering
• ECUs for starters / alternators
• DC-DC converters

Typical Structure of Alumina Multilayer Substrate

Characteristics

Example of Reliability Test Results

Alumina multilayer substrate (tested as substrate only)

Test Items	Test Conditions	Opens / Short	Insulation Resistances	Conductive Resistances	Dielectric withstand Voltages	Max. Currents / Line
Temp. Cycles	-65°C to +150°C	3000 cycles	3000 cycles	3000 cycles	3000 cycles	3000 cycles
High Temp. Storages	+150°C	3000 hours	3000 hours	3000 hours	3000 hours	3000 hours
High Temp. Humidities	85°C 85%RH	3000 hours	3000 hours	3000 hours	3000 hours	3000 hours
Thermal Shocks	0 to 100°C	3000 cycles	3000 cycles	3000 cycles	3000 cycles	3000 cycles
Low Temp. Storages	-40°C	3000 hours	3000 hours	3000 hours	3000 hours	3000 hours
High Temp. Storage with Biases	150°C 36V	N/A	3000 hours	N/A	N/A	N/A
High Temp. Humidity with Biases	85°C·85% 36V	N/A	3000 hours	N/A	N/A	N/A

For reference purposes only