Ceramic Packages

Components for Wireless Communication Devices

Kyocera provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.
Kyocera also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.

RF: Radio Frequency
FET: Field Effect Transistors
HEMT: High Electron Mobility Transistors
MIC: Microwave Integrated Circuit
MMIC: Monolithic Microwave Integrated Circuit

MMIC Packages

Kyocera offers a line of packages for high-frequency MMICs operating up to 90GHz and beyond. Various methods to support high frequency input and output are available, including waveguides, RF connectors, ceramic feedthroughs and surface mount packaging.

MMIC: Monolithic Microwave Integrated Circuit

Single-Chip Packages

Ceramic Wall Packages


Metal Wall Packages

Multi-Chip Module (MCM) Packages

Courtesy of Thales Alenia Space (France)

Kyocera provides a wide variety of custom-designed multi-chip module (MCM) packages.

Top of page