Kyocera provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.
Kyocera also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.
RF: Radio Frequency
FET: Field Effect Transistors
HEMT: High Electron Mobility Transistors
MIC: Microwave Integrated Circuit
MMIC: Monolithic Microwave Integrated Circuit
Packages with Waveguide Ports
Metal Wall Packages
Surface Mount Packages
Ceramic Wall Packages