Kyocera offers Low Temperature Co-Fired Ceramic (LTCC) materials with excellent performance characteristics for a wide range of packaging applications -- including conductors with low electrical-resistance and dielectrics with high flexural strength.
The following Radio Frequency (RF) modules and components are used in mobile communication devices such as mobile phones and mobile personal computers:
TV tuner modules, wireless LAN modules, Bluetooth®* wireless modules, Ultra-Wide Band (UWB) modules, front-end modules, power amplifier modules, SAW filters and duplexers
TV: Television; LAN: Local Area Network; SAW: Surface Acoustic Wave
Reducing the size and thickness of RF modules is possible by embedding passive components -- such as band pass filters, baluns and others -- in LTCC substrates.
Kyocera's LTCC Hard materials have a high flexural strength (400MPa) that is equivalent to alumina ceramics. They offer excellent resistance to the shock of drop-testing and are well-suited as module substrate materials in mobile communication devices. As substitutes for conventional LTCC materials, LTCC Hard substrate materials maintain the same level of mechanical integrity even with a reduction of approximately 30% in thickness. This is a result of the flexural strength of the LTCC Hard materials being two times greater than that of conventional LTCC materials.
* The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by KYOCERA Corporation is under license.