Ceramic Packages

LTCC Packages for RF Modules

Kyocera offers Low Temperature Co-Fired Ceramic (LTCC) materials with excellent performance characteristics for a wide range of packaging applications -- including conductors with low electrical-resistance and dielectrics with high flexural strength.

Material Properties

Typical Applications

The following Radio Frequency (RF) modules and components are used in mobile communication devices such as mobile phones and mobile personal computers:
TV tuner modules, wireless LAN modules, Bluetooth®* wireless modules, Ultra-Wide Band (UWB) modules, front-end modules, power amplifier modules, SAW filters and duplexers

TV: Television; LAN: Local Area Network; SAW: Surface Acoustic Wave

Miniaturization of RF Modules

Reducing the size and thickness of RF modules is possible by embedding passive components -- such as band pass filters, baluns and others -- in LTCC substrates.

LTCC Substrate with Embedded Passive Components


* The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by KYOCERA Corporation is under license.

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