Ceramic Packages

Kyocera has developed new TO ceramic packages that have higher heat resistance, higher thermal conductivity, higher withstand voltage and higher current carrying capacity than conventional materials. Our products support the spread of next generation power semiconductors such as silicon carbide (SiC) which are key for energy conservation.

Standard Products List (80KB)

• 

  TO-254 PKG / TO-257 PKG

• 

  TF-TO254 PKG

• 

  TF-TO3P PKG

Package	TO-257 PKG	TO-254 PKG	TF-TO254 PKG	TF-TO3P PKG
Drawing No.	PGMR-A6142	PGMR-A6140	GMR-A9455-A	SGMR-B4385
Plating	Ni + Au	Ni + Au	Ni	Ni + Au
Heat Sink	KYCM® (260W/mK)	KYCM® (260W/mK)	KYCM® (260W/mK)	Cu-W (175W/mK)
Lead Material	Alloy 50 (Cu cored)	Alloy 50 (Cu cored)	Alloy 50 (Cu cored)	Cu
Current Carrying Capacity	15A max.	20A max.	20A max.	50A max.
Withstand Voltage (DC)	1.0kV min.	1.0kV min.	1.0kV min.	1.2kV min.
High Temperature Storage Test	300°C 1,000 hours	300°C 1,000 hours	200°C 1,000 hours	300°C 1,000 hours
Temperature Cycling Test	-65°C to +175°C 1,000 cycles	-65°C to +175°C 1,000 cycles	-65°C to +175°C 1,000 cycles	-65°C to +175°C 1,000 cycles

Courtesy of Osaka University (TF-TO254 PKG and TF-TO3P PKG)

Notes

1. Aluminum oxide ceramic material (Kyocera A440).
2. Plating options: Ni plating or Ni + Au plating
3. KYCM is a registered trademark of KYOCERA Corporation in Japan.
4. Current carrying capacity is defined by maximum lead temperature: 80°C.
5. High temperature storage and temperature cycling tests conducted by Kyocera. Criteria based on visual and withstand voltage specifications.

　

Large-scale hybrid packages have been developed and supplied as variations of the TO ceramic packages.
We can tailor our products to your needs.