Ceramic Packages
News
2023
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May 30, 2023
"Standard Packages and Lids for Device Evaluation" list is updated.
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April 18, 2023
"Solder-Seal Metal Lids" is deleted.
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April 03, 2023
"Standard Packages and Lids for Device Evaluation" list is updated.
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March 02, 2023
OFC 2023 Expo to Feature Kyocera's Solutions for Next-Generation High-Speed Optics, Including Co-Packaged Optics with Superior Mechanical Reliability
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February 01, 2023
SPIE Photonics West 2023 to Feature Kyocera's Ceramic and Optical Components, Ceramic Package Solutions
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January 05, 2023
"Copper-Bonded Silicon Nitride Packages" is deleted.
Archive
Product Categories
- Components for LiDAR and 3D Sensing
- Compact Ceramic RFID Tags
- Components for Fiber-Optic Communication Modules
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Ceramic Packages for MEMS Sensors
- Ceramic Packages and Optical Filters for Image Sensors
- Components for Fiber-Optic Connectors
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Surface Mount Ceramic Packages for Electronic Devices
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Ceramic Packages for Light Emitting Diodes (LEDs)
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LTCC Packages for RF Modules
- Ceramic Packages for Automotive Electronics
- Ceramic Packages for Power Electronics
- Components for Wireless Communication Devices
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Ceramic Packages for Large Scale Integration (LSI) Devices
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Ceramic Substrates for Probe Cards
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Glass Hermetic Feedthroughs
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Standard Packages and Lids for Device Evaluation