News Release: Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors
- News
- 2026/04/27
Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data center architectures evolve. The new product will be unveiled at ECTC 2026, an international conference on semiconductor packaging technologies, in Orlando, Florida, USA, May 26-29, 2026.
(1): xPU is a general term for various processing units (PUs) such as CPUs and GPUs that handle AI processing.
