- Events
- 2026/02/26
Kyocera, the world leader in Fine Ceramics, will unveil its latest high-speed ceramic packages and substrates for optoelectronic devices at OFC®, the world's largest optical fiber communication conference and exposition, March 17-19, at the Los Angels Convention Center (Booth #1921).
Click here or below for product details:
https://global.kyocera.com/prdct/semicon/search_application/detail/fo.html
Venue: Los Angeles Convention Center, United States
Exhibition URL: https://www.ofcconference.org/
For over 40 years, OFC has provided a showcase to define new markets while introducing new technologies for the advancement of fiber-optic communication. OFC's exhibition floor represents the global optical communications supply chain, from sub-components and components to devices, modules, systems, and test equipment.
Kyocera, the leading manufacturer of fiber-optic device packages, has contributed significantly to the technology's evolution by pioneering high-speed electrical routing within multilayer-ceramic substrates. The company's early milestones in optoelectronics involved supporting the original U.S. broadband build-out and the optical network onboard the International Space Station. Since then, Kyocera products have supported an historic increase of more than 10,000X in optical communication data speeds -- from early 155Mbps technology to 1.6Tbps today.
OFC 2026 will spotlight new advances in enhanced high-speed packages that Kyocera has been developing since last year's show, as well as new ceramic material solutions for the evolving and highly promising technology of silicon photonics and advanced packaging expected to be widely adopted in Photonic-Electronic Convergence for AI networks. This year, Kyocera will exhibit ceramic solutions specifically engineered to build greater mechanical integrity and reliability into co-packaged optics and chiplets -- which are attracting global attention as promising alternative technologies for reducing power consumption in data centers and AI networks.
Kyocera products on display at Booth #1921 will include:
High-Speed Ceramic Packages to Enable High-Speed 1.6Tbps Signals
- "GamoThru" high-speed RF ceramic technology
- High speed LTCC wire bond / flip chip substrates
- High speed multi-layer ceramic submounts
High-Mechanical-Reliability Ceramics for Co-packaged Optics and Chiplets
- Ceramic cores for chiplets board with material options
- Ceramic stiffener for enhanced the robustness of chiplets board
