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Ceramic Packages
Product Categories
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Components for LiDAR and 3D Sensing
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Compact Ceramic RFID Tags
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Components for Fiber-Optic Communication Modules
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Ceramic Packages for MEMS Sensors
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Ceramic Packages and Optical Filters for Image Sensors
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Components for Fiber-Optic Connectors
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Surface Mount Ceramic Packages for Electronic Devices
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Ceramic Packages for Light Emitting Diodes (LEDs)
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LTCC Packages for RF Modules
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Ceramic Packages for Automotive Electronics
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Ceramic Packages for Power Electronics
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Components for Wireless Communication Devices
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Ceramic Packages for Large Scale Integration (LSI) Devices
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Ceramic Substrates for Probe Cards
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Glass Hermetic Feedthroughs
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Standard Packages and Lids for Device Evaluation
News
more-
2022/03/01
OFC 2022 Expo to Feature Kyocera's Next-Generation, High-Speed Ceramic Packages for Optoelectronics
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2022/01/17
SPIE Photonics West 2022 to Include Kyocera's Ceramic Package and Optical Component Solutions
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2021/11/11
KYOCERA will present ceramic package solutions at Science Photonics Fair 2021 Exhibition.
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2021/06/22
"Surface Mount Ceramic Packages for Electronic Devices", "RF Power Transistor Packages" are updated.
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2021/06/22
"Standard Packages and Lids for Device Evaluation" list is updated.
Related Products
Organic Packages
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Components for LiDAR and 3D Sensing
- Compact Ceramic RFID Tags
- Components for Fiber-Optic Communication Modules
-
Ceramic Packages for MEMS Sensors
- Ceramic Packages and Optical Filters for Image Sensors
- Components for Fiber-Optic Connectors
-
Surface Mount Ceramic Packages for Electronic Devices
-
Ceramic Packages for Light Emitting Diodes (LEDs)
-
LTCC Packages for RF Modules
- Ceramic Packages for Automotive Electronics
- Ceramic Packages for Power Electronics
- Components for Wireless Communication Devices
-
Ceramic Packages for Large Scale Integration (LSI) Devices
-
Ceramic Substrates for Probe Cards
-
Glass Hermetic Feedthroughs
-
Standard Packages and Lids for Device Evaluation