Ceramic Packages


June 01, 2016

KYOCERA will present its ceramic packages at ELEXCON 2016, China's most popular electronics exhibition.

KYOCERA will be exhibiting featured products and technologies at the ELEXCON 2016 - China's dominating tradeshow of "Electronic Components, Materials & Assembly" - from August 24th to 26th at the Shenzhen Convention & Exhibition Center (Shenzhen, China).

ELEXCON 2016 Exhibition Outline

Date: August 24th to 26th, Wednesday to Friday, 3 days

Venue: Halls 2, 3 and 4 at Shenzhen Convention & Exhibition Center (Shenzhen, China)

Exhibition URL: http://www.elexcon.com/elexcon/en/index.html

Kyocera Booth: 2L28 in Hall 2

Kyocera Ceramic Packages Exhibited:

1) Ultra-small SMD Packages

2) 100Gbps Packages for Fiber-Optic Communication Modules

3) Ceramic Packages and Optical Filters for CMOS Image Sensors

4) Copper-Bonded Silicon-Nitride Substrates for Power Electronics



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