Ceramic Packages

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June 01, 2016

KYOCERA will present its ceramic packages at ELEXCON 2016, China's most popular electronics exhibition.

KYOCERA will be exhibiting featured products and technologies at the ELEXCON 2016 - China's dominating tradeshow of "Electronic Components, Materials & Assembly" - from August 24th to 26th at the Shenzhen Convention & Exhibition Center (Shenzhen, China).



ELEXCON 2016 Exhibition Outline

Date: August 24th to 26th, Wednesday to Friday, 3 days

Venue: Halls 2, 3 and 4 at Shenzhen Convention & Exhibition Center (Shenzhen, China)

Exhibition URL: http://www.elexcon.com/elexcon/en/index.html

Kyocera Booth: 2L28 in Hall 2

Kyocera Ceramic Packages Exhibited:

1) Ultra-small SMD Packages

2) 100Gbps Packages for Fiber-Optic Communication Modules

3) Ceramic Packages and Optical Filters for CMOS Image Sensors

4) Copper-Bonded Silicon-Nitride Substrates for Power Electronics

etc.

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