
K Computer
(Photo: Courtesy of RIKEN/Fujitsu Limited)
© RIKEN / Fujitsu Limited
HITCE® Ceramic BGA Packages are employed in the CPU and interconnecting LSI, core components for high-speed arithmetic processing, of the famous "K Computer" supercomputer in Japan. The 10.51 petaflops (quadrillion floating-point operations per second) of computing power in the K Computer is supported by Kyocera's proprietary HITCE® Ceramic BGA Packages, characterized by their high rigidity and coefficient of thermal expansion close to that of a mounting board unit.
HITCE® Ceramic BGA Packages
Electrical Insulation to Inhibit Electricity from Passing Through
Electrical Insulation to Inhibit Electricity from Passing Through
Characteristics of Fine Ceramics
Thermal Conductivity Easily Transmits Heat
Thermal Conductivity Easily Transmits Heat
Characteristics of Fine Ceramics
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