Alumina is the most widely used Fine Ceramic today globally and epitomizes Fine Ceramics. It offers superior mechanical strength, electrical insulation, high frequency retention, thermal conductivity, heat resistance and corrosion resistance. Sapphire is a single-crystal form of alumina.

Zirconia is the strongest and toughest material among Fine Ceramics. It is used to create special blades for high-performance scissors and knives, once considered impossible application.
Single-crystal zirconia is also used in decorative applications and jewelry due to its high refractive index, which produces a diamond-like brilliance.

Among Fine Ceramics, this lightweight, corrossion resistant material offers the highest level of toughness and thermal shock resistance at high temperatures, making it ideal for use in engine components.

This artificial compound is synthesized from silica sand and carbon. It provides the best combination of heat resistance, light weight and corrosion resistance, and maintains its strength at high temperatures (1,500℃ / 2,732℉).

Low thermal expansion gives cordierite superior thermal shock resistance. Due to its porous properties, it is used for honeycomb carriers as well as refractories for electric heaters and industrial chemical equipment materials.

This magnetic ceramic exhibits high permeability, electrical resistance and abrasion resistance. It is widely used in magnetic heads and magnetic cores for high frequency electronics.

Barium titanate is used for capacitors due to its high dielectric constant and superiority in storing electricity. Additives can drastically change its dielectric properties.

A piezoelectric material vibrates when electrical signals are applied, and also converts vibration into electrical signals. Lead zirconate titanate offers strong piezoelectric properties for electronic component applications, such as resonators, buzzers and filters.

Characterized by low microwave loss, superior high temperature insulating properties and a smooth surface, fosterite is suitable for use in electron tubes and circuit boards.
In addition, its high coefficient of thermal expansion is close to that of metals and glass, allowing forsterite to be joined or bonded to these materials reliably.

With a low coefficient of thermal expansion and superior thermal shock resistance, this material is used for heat-resistant components, wire-wound resistive bobbins and electron tube components.

Mullite offers heat resistance, thermal shock resistance and excellent resistance to the structural fatigue mechanism known as "creep." It also displays a coefficient of thermal expansion similar to silicon semiconductor chips, making it useful in semiconductor package applications.

This material offers electrical and mechanical properties superior to conventional porcelains, and excellent machinability.

With excellent thermal conductivity, aluminum nitride is used in applications that require heat dissipation, such as semiconductor packages.