Semiconductor Components

China Japan

Semiconductor Components

Ceramic Packages & Substrates

High-reliability ceramic packages and substrates help to miniaturize components used in smartphones, fiber optics, automotive electronics, headlight LEDs and a wide range of other products. Kyocera utilizes its broad expertise in materials, processing, and design technologies to ensure unparalleled substrate and package performance.

  • Ceramic Surface-Mount Packages for Electronic Devices

    Ceramic Surface-Mount Packages for Electronic Devices

    Kyocera's ultra-small ceramic surface-mount packages for crystal oscillators and other components help to miniaturize smart devices while enhancing their performance.

  • Ceramic Packages for Image Sensors

    Ceramic Packages for Image Sensors

    Ceramic packages for image sensors help create smaller camera modules with higher performance.

  • Optical Components

    Optical Components

    Kyocera supports today's broadband Internet with components such as fiber-optic connectors and laser diode packages that protect signal devices and ensure high data speeds.

  • Ceramic Packages for LEDs

    Ceramic Packages for LEDs

    The excellent thermal conductivity and reliability of Kyocera's ceramics make them ideal for packaging LEDs used in applications ranging from residential lighting to vehicle headlights.

  • Multilayer Ceramic Substrates for Automotive ECUs

    Multilayer Ceramic Substrates for Automotive ECUs

    Kyocera's compact ECU substrates are used in automotive powertrain systems, where they provide high circuit density with excellent heat resistance, heat dissipation and reliability.

  • Miniature Crystal Devices

    Ultra-small ceramic packages help miniaturize highly-functional crystal devices, which are essential in today's electronics. The package shown here protects the crystal with full hermetic sealing for high reliability while measuring just 1.2 x 1mm.

  • Miniature Crystal Devices

  • LED Lighting for Superior Color Rendering

    LED lighting custom-designed for accurate color rendition is used in galleries and museums, in color inspection, and in horticulture, adding richness to life and communities.

  • LED Lighting for Superior Color Rendering

Organic Packages & Printed Wiring Boards

The rapid advancement of information and communication technologies (ICT) and the expansion of the Internet demand electronic devices with better functionality and performance. Kyocera's organic multilayer packages and printed wiring boards help meet this demand.

  • Flip-Chip Packages

    Flip-Chip Packages

    These fine-pitch multilayer packages employ the latest advances in micro-wiring and low-profile multilayer technology. They support better functionality and performance in servers, routers and mobile communication devices.

  • Substrates for Wireless Communications

    Substrates for Wireless Communications

    Kyocera's organic substrates are used in telecommunications modules for smartphones and on-board automotive systems, where embedded capacitors and other components are required.

  • Build-up Wiring Boards

    Build-up Wiring Boards

    These wiring boards are widely used in PCs, mobile devices, and other products that employ high-density surface-mounted boards.

  • High-Density Multilayer Printed Circuit Boards

    High-Density Multilayer Printed Circuit Boards

    These high-performance circuit boards are used in high-end servers and telecommunications systems, where large-scale motherboards and backplane boards may require up to 50 layers.

Organic Materials

Our other business domains extend to a wide range of industrial fields, such as digital equipment, automotive manufacturing, energy, and conservation, based on our organic material technology.

  • Epoxy Encapsulation Materials for Semiconductors

    Epoxy Encapsulation Materials for Semiconductors

    Kyocera offers new epoxy materials for transfer- and compression-molding processes that can create a vast array of lightweight, mass-produced goods.

  • Die-Attach Pastes

    Die-Attach Pastes

    Our full line of die-attach pastes for semiconductors, LEDs and electronic components can meet broad performance requirements, including high thermal conductivity and low curing temperature.

 Related Information
Semiconductor Components
Organic Packages & Printed Wiring Boards
Organic Materials

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