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Ceramic Packages

安心・安全な未来を支えるガスセンサの開発をサポート 半導体式ガスセンサの小型・薄型化、信頼性向上を実現する「セラミックパッケージ」のご提案 安心・安全な未来を支えるガスセンサの開発をサポート 半導体式ガスセンサの小型・薄型化、信頼性向上を実現する「セラミックパッケージ」のご提案

室内での空気質モニターイメージ

Indoor air quality monitoring

A typical gas sensor is a “gas alarm” that detects gas leakage and notifies with alarm sound. In recent years, they have been used in various situations, such as monitoring air quality in cars, detecting refrigerant gas in air conditioners, and monitoring indoor VOCs by installing them in air purifiers.

Furthermore, it is expected gas sensors will expand into new applications, such as personal health management by checking alcohol and breath smell by installing them in smartphones and wearable devices, and home air quality management. As such, demand for gas sensors will continue to increase in the future.

“Ceramic Packaging” Will Support Smaller and Thinner Packaging for Metal Oxide Gas Sensor

Recently MEMS (Micro Electro Mechanical Systems) chips are increasingly used for Metal Oxide gas sensors, one of the main types of gas sensor. Since MEMS chips have made it possible to make the gas sensor smaller and thinner, it is necessary to change the package size accordingly.

3mm角のパッケージ 1セントコインと比較 3mm角のパッケージ 1セントコインと比較

Comparison of 1cent coin and 3.0mmSQ package

Multilayer Ceramic Package which can apply 3D routing supports
development of smaller and thinner gas sensors.

Features of Ceramic Packages and Lid
for Metal Oxide Gas Sensors

セラミックパッケージ断面図

1<Sealing Option>

  • • Ceramic lid
    (High heat resistance / less out gas material)
  • • Fine hole concept

2<Flexible Cavity Design>

  • • Protects chip and wire by cavity
  • • Improves assembly reliability with W/B shelf
セラミックパッケージ断面図

3<Ceramic Package>

  • • High durability
  • • High heat resistance
  • • Less out gas
  • • Similar CTE to silicon

4<2nd Assembly>

  • • Surface mounting / Reflow process
  • • Side metallization
    Improves assembly reliability by solder fillet

Comparison with Metal CAN Packages

Ceramic Packages Realize
Miniaturization and a Low Profile

Metal CAN Package

Metal CAN Package

Ceramic Package

Ceramic Package

From pin insertion assembly to reflow surface assembly
Smaller and thinner package designs by 3D pattern routing
Design proposal by customized package

Comparison with
Organic Package

Ceramic Offers High Heat Resistance
and Lower Out Gas

Organic Packages Ceramic Packages Organic Packages Ceramic Packages

Kyocera's ceramic packaging contributes to the expansion of gas sensor applications, such as automotive gas sensors, because ceramic offers less out gas and high heat resistance in high temperature environments. Also, high reliability of chip assembly is expected because our ceramics have CTE close to Si and high mechanical strength. Application example : Air conditioner / Air purifier(VOC sensor) / Alarm for gas leakage

Out Gas Comparison
with Organic Packages

Organic Packages Organic Packages Ceramic Packages Ceramic Packages

*Analysis method : Continuous temperature rising GC-MS(60~310℃)
*Analysis was conducted by Kyocera

Fine Hole Concept

Dust and Water Resist Package and Lid by Fine Hole

Ceramic is capable of applying fine hole (~Φ100µm). Therefore, these fine holes are resistant to water and dust. 

Dust and water resistant concept with fine hole design Dust and water resistant concept with fine hole design Smaller and thinner structure Smaller and thinner structure

Kyocera is currenting developing a Package / Lid with a fine hole design less than φ50um. Please kindly contact us for more information.

Flexible Shipping Form
for Various Assembly method

Singulated Shipment

Singulated package is mounted on plastic tray

Plastic tray for singulated package Plastic tray for singulated package

MAT Shipment®*MAT : Metal frame with adhesive tape

MAT Shipment MAT Shipment

Singulated package is mounted on adhesive tape.

•Metal frame material : SUS

*MAT shipment is registered trademark of Kyocera Corporation

Array Shipment

Array with V-Cut (Snap Line)

Array with V-Cut (Snap Line)
Array Shipment Array Shipment

Flexible shipping option can be offered.
Please kindly consult us if there is request for shipping form.

Ceramic Package is Usable
for Various Type of Gas Sensor

NDIR Gas Sensors

NDIR gas sensors are mainly used for detecting CO₂. Kyocera offers ceramic packages for IR emitters and photodiodes. High reliability is expected due to less outgassing of CO₂ compared to organic material as well as high heat resistance. In addition, since vacuum sealing is possible, high sensitivity of the photodiode can be expected.

Click here
for NDIR gas sensor packages

Electrochemical Gas Sensors

Electrochemical gas sensors leverage chemical reactions for applications requiring high sensing accuracy for CO, NOx, and other gases. Alumina, which is a ceramic material, has strong chemical resistance and less chemical reaction to acid and alkaline solutions. Therefore, ceramic packages is usable in Electrochemical gas sensors.

Other Gas Sensors

Ceramic packages can be used for various types of gas sensors such as hydrogen, oxygen, odor sensors, etc. Kyocera has an open tool product lineup, making it is possible to conduct evaluation without incurring tooling costs.