Ceramic Packages

Simulation Technology

Simulation to Optimize Design

Kyocera offers various electrical, thermal, and mechanical simulations to ensure the design we propose will meet your specific requirements.

Electrical Simulations

electorical_simulation
Kyocera supports RLC circuit analyses and transmission loss analyses.
Click Here for High-Frequency Device Design Support

Thermal Simulation

simulation_model

Difference in Temperature Change by Material
Thermal Simulation

Stress Simulation

stress_simulation
* Stress simulation helps to optimize the design.

Examples: Electrical Simulation / Thermal Simulation

Example for Electrical Simulation and Thermal Simulation

The example below shows an analysis of Kyocera's package for a QSFP28 optical transceiver. Kyocera designed its high-frequency characteristics using electromagnetic field simulation of a model including a junction substrate (left). We also conducted thermal stress simulation (right) to confirm that the product has both high-frequency characteristics and a structure with low residual stress.

electrical_simulation_and_thermal_simulation
Kyocera customizes designs to achieve superior high-frequency characteristics and low-thermal-stress structures.
Contact us for details on various simulations.

Others

  1. Home
  2. Products
  3. Ceramic Packages
  4. Technical Support
  5. Simulation Technology