Ceramic Packages Top
Ceramic Packages
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Delivery Options

Kyocera offers shipping solutions designed for compatibility with your existing production line, as shown below.
Some options may be limited to specific package configurations.

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MAT Shipping🄬 Solution

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"MAT Shipping" is a registered trademark of Kyocera Corporation in Japan.
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Low Electrical Loss
This page introduces LTCC materials with excellent high-frequency characteristics, along with Kyocera's design support services.
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Ceramic Package Miniaturization
Miniaturization is achieved through the development of high-strength materials and improvements in processing technologies.
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Hermetic Sealing
This page provides an overview of hermetic sealing technologies for protecting components from the external environments.
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High Thermally Conductive Ceramics
By using materials with high thermal conductivity, heat generated by components is effectively dissipated.
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Matching Coefficients of Thermal Expansion
By considering the thermal expansion coefficient matching between different materials, we contribute to improved device reliability and stress relief for components.
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