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Silver Sintering Paste for Electrode

Features and Applications of Ag Sintering Paste for Electrode

Our Ag sintering paste can contribute to low resistance, low ESR, and low contact resistance for electronic components due to the sintering of Ag nanoparticles.

Features and Applications of Ag Sintering Paste for Electrode

Application Image

Application Image of Ag sintering paste

Comparison with Other Materials



Paste Type

Ag-Sintering

Resin Dispersion

Ag-Sintering

Solvent Dispersion

Ag Paste

Lead-Free Solder

Composition

Ag nanoparticles

+Resin

Ag nanoparticles
+ Solvent

Micron Ag particles
+ Resin

Composite metal
+ Flux

Adhesive Strength

Metal

Excellent

Excellent

Poor

Excellent

Non-Metal

Excellent

Poor

Excellent

Poor

Thermal Conductivity
/Conductivity

Excellent

Excellent

Good

Excellent

・ Good adhesiveness to metal/non-metal by sintering of Ag nanoparticles and resin bonding

・ Efficient conductive path by metal bond formation

Comparison with Other Materials of Ag sintering paste

Application Example:Power Inductor

Interface reliability

Ag sintering paste reliability test

Low resistivity after reliability test

Application Method

Application Method of Ag sintering paste

・Product lineup for dipping/printing

・Customization of viscosity characteristics

 according to workability is possible

General Properties



Item

Unit

CT2800 Series

Test Condition

Application
Method

-

Dipping

Printing

-

Viscosity

Pa・s

7~9

25~30

25℃, 2.0min-1

Thixotropic
Index

-

2.0~4.0

4.0~6.0

2.0min-1/20min-1

Volume
Resistivity

Ω・cm

4.5~6.5 × 10-6

4-Probe Method

Die Shear
Strength

N

20~50

25℃,Flame:Cu
Chip:Si-Die(1×1mm)

Cure Condition

-

150℃/10min+200℃/1.0h

In the Air

Dipping/Printing application lineup with equivalent cured properties

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