- Applicable to package which needs to be filled into narrow gap such as FC-CSP, FC-SiP.
- High thermal conductive type for package with high heat generation.
- Filling narrow gap with less void
- Optimized Mold Shrinkage, CTE, Modulus for various applications
- High thermal conductive type is available
- Applicable for both of transfer mold and compression mold
|FBGA (Fine pitch BGA)
|MUF(Mold Under Fill)
|Small Sized Filler Type
Narrow Gap Filling
|DRAM, RF Module
*Low alpha ray type (KE-G2250) is available.