close

Chemical Products​

Japanese site

Epoxy Molding Compounds for Semiconductors

We have cultivated the advanced technologies for Epoxy Molding Compound (EMC) over many years, and our EMC products have been used widely across many industries.

In order to support our customers to achieve lead-free packaging technology and highly reliable performance in high-temperature applications, we have developed environment-friendly products across all EMC grades by adopting non-halogen technology.

Epoxy Encapsulation Materials for Semiconductors
Package List 1
QFPQFNSOPDIPSIP
ZIP*
DiscreteModule
LargeSmallThin LargeThickSmallThinSmallPowerSMDPhoto-
Coup.
PowerGeneral
KE-G3000

☆: ideal application ○: available application
*ZIP = Zigzag Inline Package
All grades are Br/Sb free

Epoxy Encapsulation Materials for Semiconductors
Package List 2
P-BGAF-BGAModuleFinger print sensor
SingleMAP*Flip ChipMAP*Flip ChipPowerGeneralNormal DKHigh DK
KE-G1250AH
Compression Molding
KE-G1250DS
KE-G1250FC
KE-G1250LKDS
KE-G1250TC
KE-G1250HT
High Thermal Conductivity
KE-G1270
KE-G1250AH-F
KE-G1255

☆: Recommended ○: Applicable
*ZIP = Zigzag Inline Package
All grades are Br/Sb free materials.

Please contact us if you need UL certification for flame retardancy.

Back to TOP