Epoxy Molding Compounds for Semiconductors
We have cultivated the advanced technologies for Epoxy Molding Compound (EMC) over many years, and our EMC products have been used widely across many industries.
In order to support our customers to achieve lead-free packaging technology and highly reliable performance in high-temperature applications, we have developed environment-friendly products across all EMC grades by adopting non-halogen technology.
| QFP | QFN | SOP | DIP | SIP ZIP* | Discrete | Module | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Large | Small | Thin Large | Thick | Small | Thin | Small | Power | SMD | Photo- Coup. | Power | General | ||||
| KE-G3000 | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | ☆ | |||||||
☆: ideal application ○: available application
*ZIP = Zigzag Inline Package
All grades are Br/Sb free
| P-BGA | F-BGA | Module | Finger print sensor | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Single | MAP* | Flip Chip | MAP* | Flip Chip | Power | General | Normal DK | High DK | |
| KE-G1250AH Compression Molding |
☆ | ☆ | ☆ | ☆ | ○ | ||||
| KE-G1250DS | ☆ | ☆ | |||||||
| KE-G1250FC | ☆ | ☆ | |||||||
| KE-G1250LKDS | ☆ | ☆ | |||||||
| KE-G1250TC | ☆ | ☆ | |||||||
| KE-G1250HT High Thermal Conductivity |
☆ | ☆ | ☆ | ||||||
| KE-G1270 | ☆ | ☆ | |||||||
| KE-G1250AH-F | ☆ | ||||||||
| KE-G1255 | ☆ | ||||||||
☆: Recommended ○: Applicable
*ZIP = Zigzag Inline Package
All grades are Br/Sb free materials.
Please contact us if you need UL certification for flame retardancy.
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