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Epoxy Molding Compounds for Semiconductors

Our Epoxy Molding Compounds (EMCs) are widely used across many industries due to the advanced technology we have cultivated over many years.

In order to help our customers achieve lead-free packaging technology and highly reliable performance in high-temperature applications, we have developed environmentally-friendly products across all EMC grades by employing non-halogen technology.

Epoxy Encapsulation Materials for Semiconductors
Package List 1
QFPQFNSOPDIPSIP
ZIP*
DiscreteModule
LargeSmallThin LargeThickSmallThinSmallPowerSMDPhoto-
Coup.
PowerGeneral
KE-96
White
KE-200
KE-300
KE-320
KE-500
KE-850
High Thermal
Cconductivity
KE-1000
KE-G300
KE-G3000
KE-G5000

☆: ideal application ○: available application
*ZIP = Zigzag Inline Package
All grades are Br/Sb free

Epoxy Encapsulation Materials for Semiconductors
Package List 2
P-BGAF-BGAModule
SingleMAP*Flip ChipMAP*Flip ChipPowerGeneral
KE-G1250AH
Compression Molding
KE-G1250DS
KE-G1250FC
KE-G1250LKDS
KE-G1250TC
KE-G1250SK
KE-G1250HT
High Thermal Conductivity
KE-G1270

☆: ideal application ○: available application
*MAP = Mold Array Package
All grades are Br/Sb free

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