![powermodule](/prdct/chem/list/powermodule01.png)
Our EMCs for power module have low CTE, low modulus and high glass transition temperature (Tg), and achieve good reliability by reducing the stress that temperature fluctuations cause.
- Stress Relaxation >>> Warpage Control (CTE, Tg), Low Modulus
- Moldability >>> Flowability Control, Narrow Gap Filling
- Heat Resistant >>> High Tg
- Long-term Reliability >>> High tracking resistance, Low ionic impurities
![モジュール用封止材 適用基板種類](/prdct/chem/list/powermodule02.png)