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Silver Sintering Paste for Die Attach

Die attach adhesive designed for devices requiring high thermal and electrical conductivity

Feature

Strong adhesion by sintered metal approach

・High Thermal Conductivity (200W/mK)

・Outstanding Interface Reliability
 -Low Stress by Resin Dispersion System
 -High Adhesion Strength
 -Low Interface Thermal Resistance

・Sintering at Low Temperature (200deg.C)

・Durable at Operating Temp. above 200deg.C

Sintering Mechanism

ダイアタッチ用Agシンタリングのメカニズム

Workability

ダイアタッチ用Agシンタリングの作業性

・Pressureless sintering capability
  (Compatible with current DA equipment)

・Dispensable(Equivalent to traditional polymer DA)

・Long work life

・Easy bondline thickness control by own formulation

Application

Application

・Solder replacement

・AuSn solder replacement

・Laser diode

・Power LED

・Power semiconductors

X-section of bond-line

ダイアタッチ用AgシンタリングのX-section

Interface reliability

Thermal resistance(thermal cycle test)

ダイアタッチ用Agシンタリングの熱抵抗

Test Method
PKG HQFP MO188, Die(BM:Au) 6.0×6.0×0.4mm, LF Ag/Cu
Pre-con MSL1/260℃x10sx3, TCT-55℃/150℃

Die shear strength (soaking@250deg.C)

ダイアタッチ用Agシンタリングのせん断強度

Test Method
Die(BM:Au) 4.0×4.0×0.3mm, LF Pd-PPF, Measurement temperature 260℃

General Properties (Typical value)

Item

Unit

Condition

CT2700R7S

Thermal conductivity(Bulk)

W/mK

Laser flash

200

Volume resistance

ohm・cm

Four-terminal method

4.1 × 10-6

Viscosity@25deg.C

Pa・s

3°cone 0.5min-1

85

Thixotropic index

-

0.5min.-1/5min.-1

7.0

Cure condition
(Box Oven)

-

Under air

200deg.Cx90min.

-

Under inert gas

25deg.Cx90min.

Elastic modulus
(25deg.C)

GPa

DMA

21.6

Die shear strength(260deg.C)
(Ag plated Cu / 4×4mm Au Die)

MPa

Under air

>30

MPa

Under inert gas

28

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