Ceramic Packages

Large Substrates

Challenge: Demand for Large and Rigid Printed Circuit Boards (PCBs)

As circuit boards become more complex, with greater numbers of components and modules on a single board, larger PCB substrates are required. Organic substrates are prone to warp as they increase in size, potentially hindering component performance. In contrast, ceramics offer high rigidity with much lower susceptibility to warping. Moreover, while large ceramic substrates are more challenging to produce, KYOCERA can supply substrates up to 320mm in length.

Features: Kyocera's Large Ceramic Substrates

Features: Kyocera's Large Ceramic Substrates
  • Substrates up to 320mm in length are available.
    Note: Width constraints depend on length. Please contact us for details.
  • High rigidity.
  • Thermal expansion coefficient close to silicon.
  • Thin-film processing allows for high-precision circuit patterns.
  • High flatness.

Material Properties Table

Material Code Name ST300
Material Color Grayish Green
Dielectric Constant 1MHz 10.0
Dielectric Loss Tangent
(x1.0E-4)
1MHz 314
Coefficient of Thermal Expansion (ppm/K)(RT~400℃) 4.7
Thermal Conductivity (W/(m・K)) 4.0
Flexural Strengh (MPa) 319
Young's Modules of Elasticity (GPa) 194

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