Semiconductors are used in a wide variety of products all around us, including communication devices such as smartphones, home appliances such as air conditioners and ovens, and mobility devices such as automobiles and airplanes. Semiconductors have continued to evolve in order to achieve higher performance and multifunctionality in mounted devices. For example, the memory capacity of smartphones has increased. At the same time, their size has remained the same, and the performance of the processors that run smartphones has improved due to the evolution of semiconductors.
Kyocera supports the semiconductor industry by providing high-quality products and technologies related to semiconductors, utilizing the know-how and ability to make custom solution proposals we have cultivated since our founding in 1959.Below is an outline of Kyocera's semiconductor-related products and technologies, which are introduced alongside an example of the semiconductor manufacturing process.
The semiconductor manufacturing process
Mask Manufacturing
Process
Circuit formation is performed by designing a pattern using a computer and transferring it onto a photomask.
- Circuit and Pattern Design
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We design circuits for semiconductor chips and analyze for the optimum pattern through repeated simulations.
Since the required functions differ depending on the application, the design pattern differs each time. - Photomask Construction
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A photomask is the original plate used to transfer a pattern onto a silicon wafer.
A photomask is manufactured by etching a very fine circuit pattern onto a glass plate with a light-shielding film.
The semiconductor manufacturing process
Wafer Manufacturing
Process
Ingots are used to fabricate wafers and prepare them for processing.
- Slicing of Silicon Ingots
After grinding the silicon ingot to a uniform diameter, the ingot is cut into thin disks using a wire saw.
- Wafer Polishing
The wafer is cut into disks and the uneven surface is polished using abrasives and polishing pads.
Kyocera Polishing Plates Support Wafer Polishing
Polishing plates made of high-purity ceramic enable precise processing.
The ceramic also has excellent wear resistance so that the surface can be maintained in good condition for a long time.
The semiconductor manufacturing process
Pre-Process
Before the circuit is formed
on the substrate
Hundreds of LSI chips (large-scale integrated circuits) consisting of billions of transistors are made on a wafer made from silicon.
- Oxidation of the Wafer Surface
To bake the circuit pattern, the wafer surface is oxidized to form an oxide film on the wafer.
- Thin Film Formation
Thin film formation of various materials is performed.
Kyocera's Durable Ceramic Plasma Proofs Support the Components in the CVD Equipment Chamber!
Thin film deposition processes require the durability of the equipment itself, as it is exposed to plasma environments and the use of corrosive gases. Kyocera's ceramic materials have excellent plasma and heat resistance, low particle counts, and low dielectric loss.
Kyocera's Piezoelectric Devices Support Precise Gas Control!
Kyocera's piezoelectric devices are used in mass flow controllers that control the flow rate of process gases.
Piezoelectric devices expand and contract when electricity is applied, and Kyocera's own products are nearly 10 times faster in response speed compared to a crimp-style valve.
In addition, they have a structure (crack control layer) that avoids failure modes caused by cracks, thus ensuring high reliability.
The high quality of this product is also proven by the fact that it is used as a component for automotive applications.
※ Mass flow controller: A device that precisely controls the flow rate of process gas supplied to the wafer.
- Photoresist Coating
A photosensitive agent called photoresist is uniformly applied to transfer the circuit pattern.
- Exposure and Development
Using an exposure device, light is irradiated onto the photoresist through a photomask and lens, and the circuit pattern is repeatedly transferred. In photography, this process corresponds to "development."
Kyocera's Ceramic Wafer Stage Components Support the Performance of Lithography Equipment!
In the process of manufacturing a single semiconductor, circuit patterns are repeatedly baked onto the wafer, requiring technology to accurately and repeatedly overlap the wafer and photomask without misalignment. Kyocera develops and supplies lightweight, rigid, and high-precision wafer stage components made to order. We use cordierite ceramic for the material, which has an extremely low coefficient of thermal expansion and provides a high degree of smoothness. Its precision is such that it is used in the Subaru Telescope installed atop Mauna Kea in Hawaii.
- Etching
Gas is plasmaized in a vacuum chamber to remove oxide film and other unwanted materials.
Kyocera's Ceramics Withstand High Power Plasma with Various Gases to Support Increased Productivity!
As the number of layers increases, the number of etching processes and the time required for etching inevitably increases Kyocera's ceramic materials, which can withstand high plasma power, are used as chamber components.
- Resist Stripping and Cleaning
Remove unneeded resist.
- Ion Drench
Ions are injected into the wafer, and heat treatment is performed. This process is essential for semiconductors to operate as transistors.
- Planarization(CMP)
Planarization (CMP) is the process of polishing the surface of a wafer to remove irregularities and flatten the surface.
Kyocera's Vacuum Chuck Supports High-Precision Wafer Surface Polishing!
The vacuum chuck is used to firmly fix and polish wafers and has characteristics such as high purity and excellent chemical resistance. The vacuum chuck is used to firmly fix the wafer in place and perform the polishing process.
- Electrode Formation
Open a hole in the oxide film and embed an electrode.
- Assembly and Wafer Inspection
Using a probing machine, all chips formed on wafers are inspected for electrical characteristics, and defective chips are sorted out.
Kyocera Components Support Probing Machines that Inspect Electrical Characteristics!
Kyocera's ceramic substrates for probe cards are used in probing machines that inspect the electrical characteristics of all the ultra-small chips on the wafer while applying heat because they have a coefficient of thermal expansion close to that of silicon wafers and are rigid and resistant to deflection. Also, the optical unit is used because of its high vibration resistance.
The semiconductor manufacturing process Post-process From plating to inspection and shipping
After semiconductor chips are cut from wafers, they are assembled and inspected.
- Plating
Plating is performed for flip chip mounting.
- Bumps
Solder bumps are formed on the electrode portion of the wafer.
- Wafer Dicing
Wafers are cut with a blade and divided into individual chips.
Kyocera's Vacuum Chuck and Optical System Unit Support Dicing Machine Components!
Kyocera's vacuum chuck and optical system unit are used to reduce blurring that occurs during dicing. Compact design is possible to match the machine and has anti-vibration performance and dustproof/waterproof performance (IP64 grade). Kyocera optical lenses are also used to focus the laser beam during dicing, contributing to accurate dicing.
- Assembling
Packaging is used to protect the individual chips.
Packaging materials include organic, ceramics, leadframes, die attach paste, and molding compounds for encapsulation.
Leave it to Kyocera for All Your Ceramic and Organic Packaging Needs!
Kyocera manufactures ceramic packages, organic packages, die attach paste, and molding compounds for encapsulation.
We tailor proposals to our customers' requirements to maximize the characteristics of each material, and our products are used in a wide range of applications, from consumer products to infrastructure and automotive applications.
Kyocera's Optical Units Support Exposure of Base Materials During Mounting!
Kyocera optical lenses are also used in the equipment to expose silicon wafers.
- Inspection and Shipping
After repeated inspections such as burn-in (humidity voltage test), product inspections, and reliability tests are conducted to check for any defective products, products that pass the inspections are molded and shipped.
Spotlight More Support Extra
Thin and compact capacitors that can be placed in the gaps between semiconductor packages to save space
Capacitors are electronic components that support the operation of electronic devices.
Kyocera has developed thin-type, high-capacity capacitors that can be mounted in the small gaps between BGAs and withstand altitude temperatures of 105°C.
For example, a single smartphone contains approximately 700~1000 capacitors, so it is important to reduce the size and space of each capacitor.
Reference：SEMI FREAKS, SEMI Japan's semiconductor industry research site