Our Ag sintering paste for electrodes achieves lower electrical resistance, lower ESR, and lower contact resistance in the product by utilizing sintering of nano-silver powder. It also adheres to non-metallic surfaces due to its resin composition.
Type of paste | KYOCERA Ag sintering |
Pure sintering | KYOCERA Ag paste |
Pb free solder |
|
Composition |
Nano Ag powder |
Nano Ag powder |
Micro Ag powder |
Composite metal |
|
Adhesion to | Metal | ++ | ++ | + | ++ |
Non -Metal |
++ | - | ++ | - | |
Electrical conductivity | ++ | ++ | + | ++ |
・Available lineup for dip coating and screen printing
・Customizable viscosity characteristics for required workability
・Lower electrical resistance than epoxy silver paste
・Low electrical resistance even after reliability test
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