Greetings from the CMOS (Complementary Metal-Oxide-Semiconductor) Package Business Division at our Sendai Plant in Japan!
This team is dedicated to advancing the front-end processes for ceramic packages used in camera modules. They focus on establishing manufacturing specifications for new products, enhancing quality and yield, and driving productivity improvements.
Going forward, the CMOS team plans to actively identify and address challenges in manufacturing specifications for next-generation developments by working closely with colleagues in development departments. Their goal is to innovate the camera module manufacturing process and build a robust foundation to support future product generations.
To achieve this, they closely monitor our processes and leverage data analysis to rapidly identify and resolve issues. They also invest in process improvement training for their members, continually strengthening their team's capabilities.
By establishing solid manufacturing specifications and driving process innovation, the CMOS Package team is committed to delivering highly reliable and competitive manufacturing technologies that form the backbone of next-generation products.
This team is dedicated to advancing the front-end processes for ceramic packages used in camera modules. They focus on establishing manufacturing specifications for new products, enhancing quality and yield, and driving productivity improvements.
Going forward, the CMOS team plans to actively identify and address challenges in manufacturing specifications for next-generation developments by working closely with colleagues in development departments. Their goal is to innovate the camera module manufacturing process and build a robust foundation to support future product generations.
To achieve this, they closely monitor our processes and leverage data analysis to rapidly identify and resolve issues. They also invest in process improvement training for their members, continually strengthening their team's capabilities.
By establishing solid manufacturing specifications and driving process innovation, the CMOS Package team is committed to delivering highly reliable and competitive manufacturing technologies that form the backbone of next-generation products.
