High-performance computing and the cloud are driving transformative shifts in the technology world. However, as integrated circuits and Si interposers increase in size, securing substrate materials with a low enough thermal expansion coefficient is becoming a difficult challenge.
To respond to market needs for stable, reliable components, Kyocera is developing advanced ceramic substrates with high rigidity and thermal expansion close to Silicon.
Discover Kyocera's comprehensive information and communications solutions, including smartphones, document solutions, and semiconductor and electronic components, at our ICT landing page here: https://global.kyocera.com/ict-solutions/index.html
To respond to market needs for stable, reliable components, Kyocera is developing advanced ceramic substrates with high rigidity and thermal expansion close to Silicon.
Discover Kyocera's comprehensive information and communications solutions, including smartphones, document solutions, and semiconductor and electronic components, at our ICT landing page here: https://global.kyocera.com/ict-solutions/index.html
