By Material

About Aluminum Nitride

With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.

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(Shown in alphabetical order)

  • Photo
  • Product name / Item description
  • Features
  • Applications
  • Link
PHOTO: Link to Link to Electrostatic Chucks (ESCs)

Electrostatic Chucks (ESCs)

High purity, excellent plasma resistance and de-chucking response suitable for a wide range of temperatures.
  • Plasma Resistance
  • Wafer Holding
  • Flatness Correction
  • Cooling
PHOTO: Link to Link to Heaters


High purity with excellent plasma resistance and thermal uniformity.
  • Plasma Resistance
  • High Thermal Conductivity
  • Thermal Uniformity
  • Wafer Heaters
KYOCERA provides support right from the material selection stage.

Please discuss your requirements such as conditions, shape and size, precision and budget with us. We will suggest the best materials and manufacturing methods from our extensive range to answer your needs.

  • PHOTO: Link to Inquiries
  • PHOTO: Link to Global Contact