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Kyocera Celebrates the Completion of its Nagasaki Isahaya Plant

 
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Kyocera Corporation (President: Shiro Sakushima, hereinafter "Kyocera") held a ceremony on September 1, 2026, to mark the completion of its Nagasaki Isahaya Plant (Kuremo-machi, Isahaya, Nagasaki), a new manufacturing facility for the company.


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Photos from the ceremony celebrating the plant's completion


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The Nagasaki Isahaya Plant will be a key production site for Kyocera to accelerate its semiconductor-related business, which the company has positioned as a medium- to long-term growth driver. Production equipment will be installed in phases, with full-scale operations scheduled to begin in spring 2027.

The plant will manufacture fine ceramic components for semiconductor manufacturing equipment, as well as semiconductor packages used in a wide range of electronic devices. Through these products, Kyocera aims to meet growing global demand driven by the expansion of AI data centers, advances in advanced driver-assistance systems (ADAS), and the increasing adoption of electric vehicles.

By constructing the Nagasaki Isahaya Plant, Kyocera aspires to achieve the sustainable growth of its business while contributing to regional employment and industrial development. The company will also leverage the facility to showcase and deliver high-value-added products from Nagasaki to customers around the world.


Overview of the Completion Ceremony

Date

September 1, 2026 (Tuesday), 10:30 a.m. to 11:15 a.m.

Location

Nagasaki Isahaya Plant, Kyocera Corporation

Attendees

Shiro Sakushima, President and Representative Director

Hiroaki Chida, Director and Managing Executive Officer

Other company representatives



Overview of the New Plant

Plant Name

Nagasaki Isahaya Plant

Address

541-53 Kuremo-machi, Isahaya, Nagasaki, Japan

Total Investment

Approximately 68 billion yen by the end of March 2029

Total Site Area

Approximately 154,000m2 (1,657,641ft2)

Main Building

Plant No.1 (six-story steel-frame structure)

Building footprint: Approx. 14,959 m² (161,017ft2)

Total floor area: Approx. 80,799 m² (869,713ft2)

Construction Schedule

Construction started in September 2024. Following the plant's completion in September 2026, production is scheduled to begin in phases.

Production Items

Fine ceramic components, semiconductor packages, and related products

Production Capacity

Approximately 25 billion yen per year from fiscal year 2030 onward






This news release is intended for media purposes, and is current of the date of publication. Information is subject to change without notice.