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KYOCERA to Build Two New Plants for Ceramic Components Supporting IoT, 5G

Expansion will double production capacity in Kagoshima, Japan, for customers worldwide

October 21, 2021Japan

Kyocera Corporation (President: Hideo Tanimoto, hereinafter “Kyocera”) announced today that it will construct two additional production facilities at its Kokubu Plant Campus in Kagoshima, Japan, to serve customers worldwide. The new facilities will double the campus’ production capacity for fine ceramic components used in semiconductor manufacturing equipment, while securing space for other manufacturing as Kyocera’s business expands. A signing ceremony held on October 20, 2021 included Kagoshima Governor Koichi Shiota, Kirishima City Mayor Shinichi Nakashige, and Kyocera officials. Construction is scheduled to begin in November 2021.

The growth of Internet of Things (IoT) and 5G telecommunications services is fueling demand for semiconductors used in nearly everything from personal computers, smartphones, and data centers to automobiles. To respond to this acceleration in the semiconductor market, Kyocera is increasing production of high-demand fine ceramic components used in semiconductor manufacturing equipment. The company plans to begin production of fine ceramic components at the new No.7-1 plant in October 2022, and at the No.7-2 plant in October 2023. Photo:Fine ceramic components used in semiconductor manufacturing equipment
Fine ceramic components used in semiconductor manufacturing equipment

Photo:Architect’s rendering of the new facilities, No.7-1 (right) and No.7-2 (left).
Architect’s rendering of the new facilities, No.7-1 (right) and No.7-2 (left).

Kyocera expects its fine ceramic business expansion to stimulate economic development in Kagoshima Prefecture and create new employment opportunities in the community.

■Outline of New Facilities
Name Plants No.7-1 & 7-2 at Kyocera’s Kagoshima Kokubu Plant Campus
Address 1002-1 Kokubukamikogawa, Kirishima-shi, Kagoshima Prefecture, Japan
Total investment Approximately 11 billion yen (approx. 97 million U.S. dollars)
Building footprint No.7-1: 5,174 m2 (55,692 f2), steel construction, 2 stories
No.7-2: 6,996 m2 (75,304 f2), steel construction, 6 stories
Total area No.7-1: 10,120 m2 (108,931 f2) / No.7-2: 37,497 m2  (403,614 f2)
Construction plan No.7-1: Construction to begin November 2021
Facility to open October 2022
No.7-2: Construction to begin November 2021
Facility to open October 2023
Production items Fine ceramic components for semiconductor manufacturing equipment used in IoT, 5G telecommunications and other applications
Expected production level Approximately 3.4 billion yen (approx. 30 million U.S. dollars) per year (April 2023-March 2024)

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