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KE-G1250HT Series High Thermal-Conductivity Epoxy Molding Compound

KE-G1250HT ヒートシンク付BGA

The thermal conductivity of this series ranges from 3-4W/mK allowing it reduce the thermal resistance of packages.

We have a wide line of high thermal conductivity grades that are not only applicable for transfer molding, but also for compression molding as well as for Flip Chip BGA.

KE-G1250HT Standard Grade
CharacteristicUnitKE-
G1250HT-W
KE-
G1250HT-C
KE-
G1250HT-U
Application FBGA/P-BGA・HS-BGA Cu/Au Wire
Spiral Flow (70kgf/cm2) cm 150 150 160
Gelation Time s 45 45 45
Flow Viscosity Pa•s 7.0 7.0 6.0
CTE α1 ppm/K 12 12 12
CTE α2 ppm/K 44 43 43
Tg °C 140 140 140
Mold Shrinkage % 0.11 0.14 0.18
Specific Gravity - 2.88 2.88 2.88
Thermal Conductivity W/mK 3 3 3
Ionic Impurity Cl¯ ppm 10 10 10
pH - 6.0 6.0 6.0
KE-G1250HT Special Grade
ItemUnitKE-
G1250HT-4W
KE-
G1250HT-CP
KE-
G1250HT-FC
Characteristic High thermal resistance Compression molding Flip Chip BGA
Filler Top Cut
:25µm
Spiral Flow (70kgf/cm2) cm 160 160 130
Gelation Time s 47 55 45
Flow Viscosity Pa•s 7.0 10.0 7.0
CTE α1 ppm/K 13 11 12
CTE α2 ppm/K 40 38 44
Tg °C 150 150 145
Mold Shrinkage % 0.11 0.10 0.26
Specific Gravity - 3.10 2.88 2.88
Thermal Conductivity W/mK 4 3 3
Ionic Impurity Cl¯ ppm 10 10 10
pH - 6.0 6.0 6.0

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