![セラミックパッケージ断面図](/prdct/semicon/lp/gassensor_pkg_semiconductor/img/img03_sp.png)
1<Sealing Option>
- • Ceramic lid
(High heat resistance / less out gas material) - • Fine hole concept
2<Flexible Cavity Design>
- • Protects chip and wire by cavity
- • Improves assembly reliability with W/B shelf
![セラミックパッケージ断面図](/prdct/semicon/lp/gassensor_pkg_semiconductor/img/img03.png)
3<Ceramic Package>
- • High durability
- • High heat resistance
- • Less out gas
- • Similar CTE to silicon
4<2nd Assembly>
- • Surface mounting / Reflow process
- • Side metallization
Improves assembly reliability by solder fillet