Substrates for Power Modules

PHOTO: Substrates for Power Modules

High-strength substrates compatible with direct-bonding of copper sheets are suitable for a wide range of power module applications.

Kyocera manufactures high-strength substrate materials for power module applications. Available materials are Alumina (A476T, A477A) and Zirconia-toughened Alumina (AZ211), depending on your requirements for performance and cost.

Features

  • High Strength
  • Coefficient of Thermal Expansion
  • Insulation
  • Product specs
  • Features
  • Applications

Product specs

Material Alumina / Alumina-Zirconia
Shape Substrate

Features

Size & Characteristics

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*Values are typical data from test pieces.

Applications

Power Module Parts

Power Module Parts