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· Surface Mount Ceramic Packages for Electronic Devices
· Ceramic Packages and Optics for Image Sensors

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Multilayer Ceramic Substrates for ECUs
Component Assembly Technology for Ceramic ECUs
LED Packages
Ceramic Packages for MEMS Sensors
Image-Sensor Packages
Millimeter-Wave Packages
Lids / Lids with RF Absorbers
 
· Ceramic Packages for Large Scale Integration (LSI) Devices
· Components for Wireless Communication Devices
RF Power Transistor Packages
Thin-Film MIC Substrates
MMIC Packages
· LTCC Packages for RF Modules
· Packages and Lids for Evaluation (Standard Product Lists)
 Material Properties
 Process Flow
 Web Presentation
 
· Ceramic Packages for MEMS Sensors
· Ceramic Packages for Light Emitting Diodes (LEDs)
· Ceramic Packages for Power Electronics
Copper-Bonded Silicon Nitride Packages for Power Modules
· Components for Fiber-Optic Communication Modules
LD / PD Submounts
Packages for Fiber-Optic Communication Modules
Optical Isolators
Receptacles
RF Absorber Lids
· Components for Fiber-Optic Connectors
Ferrules
Sleeves
· Ceramic Substrates for Probe Cards

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