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Products > Semiconductor Components > Components for Wireless Communication Devices > MMIC Packages 
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MMIC Packages

Kyocera offers a line of packages for high-frequency MMICs operating up to 90GHz and beyond. Various methods to support high frequency input and output are available, including waveguides, RF connectors, ceramic feedthroughs and surface mounting using leadframes or BGA packaging. Kyocera also offers low-thermal-resistance heat sinks made of CM4 (Kyocera material code) in addition to conventional copper tungsten (CuW) and copper molybdenum (CuMo) for high-power devices.


MMIC: Monolithic Microwave Integrated Circuit


Available in custom and standard designs


Standard Products List  (pdf/26KB) PDF


 Single-Chip Packages
Single Chip Packages

 Multi-Chip Module (MCM) Packages
Multi-Chip Module (MCM) Packages   Kyocera provides a wide variety of custom-designed multi-chip module (MCM) packages.
Courtesy of Thales Alenia Space (France)


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Packages with Waveguide Ports