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Products > Semiconductor Components > Components for Wireless Communication Devices > MMIC Packages  Japanese

MMIC Packages

Kyocera has package lineup for high frequency MMICs up to 90GHz and beyond. There are various methods for high frequency input and output - waveguide, RF connectors, ceramic feedthroughs, surface mounting (leadframes or BGA) etc. Also, Kyocera has low thermal resistance CM4 (Kyocera material code) in addition to conventional copper tungsten (CuW) and copper molybdenum (CuMo) for high power devices.

We provide custom design products to meet customer’s requirements, and also we have some standard products.
Standard Products List  (pdf/26KB) PDF

 Single Chip Packages
Single Chip Packages

 Multi-Chip Module (MCM) Packages
Multi-Chip Module (MCM) Packages   Kyocera provides a wide variety of custom design multi-chip module (MCM) packages.
Courtesy of Thales Alenia Space (France)

Note: MMIC stands for Monolithic Microwave Integrated Circuits

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Packages with Waveguide Ports