Components for Wireless Communication Devices


Kyocera provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.

Kyocera also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.

RF: Radio Frequency; FET: Field Effect Transistors; HEMT: High Electron Mobility Transistors; MIC: Microwave Integrated Circuit; MMIC: Monolithic Microwave Integrated Circuit

Standard Products List of Surface Mount Packages  (pdf/66KB) PDF

 RF Power Transistor Packages more 
FET/HEMT Packages RF Power Transistor Packages

 Thin-Film MIC Substrates more 
Thin-Film MIC Substrate High Purity Almina Substrates

 MMIC Packages more 
Packages with Waveguide Ports Packages with Waveguide Ports Metal Wall Packages Metal Wall Packages

Surface Mount Packages Surface Mount Packages Ceramic Wall Packages Ceramic Wall Packages

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Standard Packages and Lids for Device Evaluation
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