Components for Wireless Communication Devices

Kyocera provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.

Kyocera also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.

RF: Radio Frequency; FET: Field Effect Transistors; HEMT: High Electron Mobility Transistors; MIC: Microwave Integrated Circuit; MMIC: Monolithic Microwave Integrated Circuit

Standard Products List of Surface Mount Packages  (pdf/26KB)