Components for Wireless Communication Devices

Kyocera provides ceramic-to-metal seal packages for Radio Frequency (RF) power transistors such as Field Effect Transistors (FETs) and High Electron Mobility Transistors (HEMTs). Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.

Kyocera also supplies thin film metallized ceramic substrates for hybrid Microwave Integrated Circuits (MICs), in addition to Monolithic Microwave Integrated Circuit (MMIC) packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies of 90GHz and beyond.

Standard Products List of Surface Mount Packages  (pdf/26KB)