Ceramic Packages

High-Frequency / RF Device Packages, Lids, and Substrates

Ceramic Packages Support Wireless Communication Infrastructure

Kyocera supplies ceramic packages for power amplifiers used in wireless communication, including mobile phone base stations, and for high-frequency applications such as weather radars.

Enhancing High-Frequency Performance and Thermal Management

Kyocera provides ceramic package options to optimize high-frequency performance for wireless communication applications, including RF power transistors, thin-film MICs, and MMICs, with specialized lids engineered for each package type.

*MIC: Microwave Integrated Circuit
*MMIC: Monolithic Microwave Integrated Circuit

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