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Components for Wireless Communication Devices |
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Components for Wireless Communication Devices |
| Kyocera provides FET/HEMT packages, thin film MIC substrates, MMIC packages and lids for wireless communication devices. |
| FET/HEMT Packages |
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FET/HEMT Packages |
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| Thin Film MIC Substrates |
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High Dielectric Substrate |
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High Purity Alumina Substrate |
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| MMIC Packages |
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Packages with Waveguide Ports |
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Metal Wall Packages |
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Surface Mount Packages |
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Ceramic Wall Packages |
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