Kyocera offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time. Please contact us for details.
C-DIP
(Ceramic Dual Inline Packages)
C-SOP
(Ceramic Small Outline Packages)
Surface Mount Ceramic Packages for Electronic Devices
CERQUAD® Packages
C-QFP
(Ceramic Quad Flat Packages)
C-PGA
(Ceramic Pin Grid Array Packages)
C-QFN (Ceramic Quad Flat
Non-Leaded Packages)
C-QFJ (Ceramic Quad Flat
J-Leaded Packages)
Ceramic Hybrid Packages
Surface Mount Ceramic Packages for MMICs
Packages for Fiber-Optic Communication Modules
Ceramic Packages for Image Sensors
Ceramic Packages for LEDs
Epoxy-Seal Ceramic Lids
Glass-Seal Ceramic Lids