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Ceramic Packages for General Purposes |
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Ceramic Packages for General Purposes |
| Kyocera has a wide variety of standard ceramic packages such as C-DIP, C-PGA, C-QFP, C-QFJ, C-QFN etc. They might be useful for your device evaluation or small quantity of production. Tooling cost and time for new designs could be saved. Please contact us for more detail. |
| C-DIP (ceramic dual inline package) |
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C-QFN (ceramic quad flat non-leaded package) |
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Leadframes are brazed on two sides of a multilayer ceramic substrate. So they are often called side brazed packages. |
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Electrical terminals are exposed from side walls to the bottom of a multilayer ceramic substrate. They are often called ceramic leadless chip carriers (CLCCs). |
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| C-PGA (ceramic pin grid array package) |
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C-QFJ (ceramic quad flat J-leaded package) |
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Needle-like pins are set up in a grid array form and they are brazed on a multilayer ceramic substrate. |
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Leadframes are brazed on the top of a multilayer ceramic substrate and the leads are J-formed for surface mounting. |
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| C-QFP (ceramic quad flat package) |
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C-QFP (ceramic quad flat package) |
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Leadframes are attached on a press formed single-layer ceramic substrate by using crystallized glass. Kyocera calls it a CERQUAD package. |
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Leadframes are brazed on the top or bottom of a multilayer ceramic substrate. |
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