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Standard Packages and Lids for Device Evaluation

(Standard Products List)

Kyocera offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time. Please contact us for details.  Packages C-DIP (Ceramic Dual Inline Packages) Standard Products  (pdf/81KB)  SOP (Small Outline Packages) Standard Products  (pdf/40KB)  Surface Mount Packages for Electronic Devices Standard Products  (pdf/36KB)  C-QFP (Ceramic Quad Flat Packages) Standard Products  (pdf/162KB)  C-QFP (Ceramic Quad Flat Packages) Standard Products  (pdf/57KB)  C-PGA (Ceramic Pin Grid Array Packages) Standard Products  (pdf/206KB)  C-QFN (Ceramic Quad Flat Non-Leaded Packages) Standard Products  (pdf/109KB)  C-QFJ (Ceramic Quad Flat J-Leaded Packages) Standard Products  (pdf/43KB)  Hybrid Packages Standard Products  (pdf/101KB)  Surface Mount Packages for MMICs Standard Products  (pdf/26KB)  Packages for Fiber-Optic Communication Modules Standard Products  (pdf/20KB)   Lids Epoxy-Seal Ceramic Lids Standard Products     Rectangular Flat Shape  (pdf/68KB)    Rectangular Cup Shape   (pdf/322KB)    Round Cup Shape   (pdf/142KB)  Glass-Seal Ceramic Lids Standard Products (pdf/27KB)  Solder-Seal Metal Lids Standard Products  (pdf/23KB)  Semiconductor Components