Skip to main content Go to KYOCERA HOME Global THE NEW VALUE FRONTIER
Home      News      Products      About   
Inquiries about this page
Semiconductor Components Sitemap    
Semiconductor Components
Surface Mount Ceramic Packages for Electronic Devices
Material Properties
Process Flow
Web Presentations
Products > Semiconductor Components > Surface Mount Ceramic Packages for Electronic Devices 
Japanese
中文(Chinese)

Surface Mount Ceramic Packages for Electronic Devices

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Kyocera also supplies frit-seal ceramic lids and solder-seal metal lids. Custom and standard designs are available.

SAW: Surface Acoustic Wave; RF: Radio Frequency; MEMS: Micro-Electro-Mechanical Systems

Standard Products List  (pdf/36KB) PDF

General Applications
Crystal Units, Crystal Oscillators, SAW Filters, Duplexers, and MEMS Devices (Accelerometers, Gyroscopes, Pressure Sensors, Magnetic Sensors, Infrared Sensors, Micro Mirror Arrays, Silicon Microphones, Silicon Oscillators, RF MEMS Switches, etc.)

Surface Mount Packages for Electronic Devices Surface Mount Packages for Electronic Devices

 Application Examples
Left: MEMS Accelerometers
Right: MEMS Gyroscopes
Copyright Analog Devices, Inc.
All rights reserved.

 High Strength Alumina: AO700
Material Properties
This alumina (Al2O3) ceramic material has a flexural strength (620MPa) approximately 1.5 times higher than conventional alumina ceramics (400MPa). It is suitable for small packages, including 2520 (2.5mm x 2.0mm) size and smaller.


Increased Cavity Area and Decreased Thickness
with High Strength Alumina

(2016 size package example)
An Example of 2016 Size Package
Size Reduction by High Strength Alumina

Semiconductor Components

 
Related Products
Standard Packages and Lids for Device Evaluation
   
 
Top of page
Products > Semiconductor Components > Surface Mount Ceramic Packages for Electronic Devices 
Contact      Terms of use      Privacy      Sitemap     
Copyright KYOCERA Corporation