Surface Mount Ceramic Packages for Electronic Devices

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Hermetic or vacuum-sealing is typically applied to ensure device quality. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. Kyocera also supplies frit-seal ceramic lids and solder-seal metal lids. Custom and standard designs are available.

Standard Products List  (pdf/36KB) 

General Applications
Crystal Units, Crystal Oscillators, SAW Filters, Duplexers, and MEMS Devices (Accelerometers, Gyroscopes, Pressure Sensors, Magnetic Sensors, Infrared Sensors, Micro Mirror Arrays, Silicon Microphones, Silicon Oscillators, RF MEMS Switches, etc.)