Ceramic Packages / Lids for Quartz Crystal Devices
Packages for crystal devices require hermeticity; and market demand is trending toward smaller, lower-profile packages. Kyocera's ceramic packages have a long track record with continuous improvement in miniaturization and hermetic sealing options, including ceramic package lids for frit glass sealing.
Features
Low Profile
Miniaturization
The number of crystal devices required in electronic equipment keeps increasing as equipment functionality expands, raising demand for miniaturization.
Kyocera continues to develop market-leading ultra-miniaturized, low-profile packages. We are currently mass-producing the world's smallest (*) 1.0 x 0.8 mm package, with even smaller products (0.8 x 0.6 mm) in development.
*Kyocera research as of 2023
Downsizing Trend: Quartz Crystal
Miniaturization requires higher-strength materials and precision manufacturing processes.
Higher-strength alumina ceramic allows thinner walls and bottom layers, thereby contributing to the miniaturization and lower profile of the device.
In addition, package miniaturization requires higher-precision manufacturing processes. Kyocera has succeeded in mass-producing the world's smallest class of packages by improving process accuracy with proprietary manufacturing technologies.
Hermetic Sealing
Multiple sealing options to achieve hermeticity.
Ceramic packages can be hermetically sealed through various sealing options. Typical methods of hermetic sealing are described below.
Ceramic Lids with Frit Glass Sealing
In addition to ceramic packages, Kyocera manufactures ceramic lids for frit glass sealing in a wide range of standard sizes.
