Ceramic Packages

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Ceramic Packages for Power Electronics

Kyocera provides power electronics packages by using ceramic-to-metal bonding technologies.

TO-254 / TO-257 Ceramic Packages

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  • Copper-core pins and metal heat sinks are bonded onto multilayer alumina ceramic packages
  • High reliability: Hermeticity and dielectric withstand voltage confirmed after 1000 cycles (-65°C to +175°C) of temperature cycling test (sample: ten pieces; Kyocera test results)
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