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Kyocera offers LTCC materials with various features. You will be able to find a LTCC material suitable for your application.
Typical Applications
The following RF modules and components used in mobile devices such as cellular phones:
TV tuner, wireless LAN, Bluetooth®* wireless, Ultra Wide Band (UWB), front end module, power amplifier module, SAW filter and duplexer |
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 Size Reduction and Lower Profile of Module |
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Size and thickness reduction of the RF modules are made by embedded passive components (band pass filter, balun and so on) in LTCC substrates.
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| Construction of LTCC Substrate with Embedded Passive Components |
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| High Strength Materials (“LTCC Hard”) : GL950, GL330 |
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“LTCC Hard” has high flexural strength (400MPa) equivalent to alumina ceramics. It offers excellent resistance to the shock of drop testing and is well suited as a module substrate material in mobile devices. As a substitute for conventional LTCC material, “LTCC Hard” substrate material keeps the same level of mechanical strength even with approximately 30% thickness reduction. This is because the flexural strength of the “LTCC Hard” is two times greater than the conventional LTCC. (Calculated from flexural strength)
*The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc.
and any use of such marks by KYOCERA Corporation is under license. |
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| Related limk |
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