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LTCC Packages for RF Modules
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Products > Semiconductor Components > LTCC Packages for RF Modules  Japanese

LTCC Packages for RF Modules

LTCC Packages for RF Modules Kyocera offers LTCC materials with various features. You will be able to find a LTCC material suitable for your application.

Material Property Table

Typical Applications
The following RF modules and components used in mobile devices such as cellular phones:
TV tuner, wireless LAN, Bluetooth®* wireless, Ultra Wide Band (UWB), front end module, power amplifier module, SAW filter and duplexer
 Size Reduction and Lower Profile of Module
Size and thickness reduction of the RF modules are made by embedded passive components (band pass filter, balun and so on) in LTCC substrates.

Size Reduction and Lower Profile of Module
 Construction of LTCC Substrate with Embedded Passive Components
Construction of LTCC Substrate with Embedded Passive Components
 High Strength Materials (“LTCC Hard”) : GL950, GL330
“LTCC Hard” has high flexural strength (400MPa) equivalent to alumina ceramics. It offers excellent resistance to the shock of drop testing and is well suited as a module substrate material in mobile devices. As a substitute for conventional LTCC material, “LTCC Hard” substrate material keeps the same level of mechanical strength even with approximately 30% thickness reduction. This is because the flexural strength of the “LTCC Hard” is two times greater than the conventional LTCC. (Calculated from flexural strength)

*The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc.
and any use of such marks by KYOCERA Corporation is under license.

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