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Ceramic Packages for Light Emitting Diodes (LEDs) |
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Ceramic Packages for Light Emitting Diodes (LEDs) |
| Kyocera provides multilayer ceramic packages and single layer ceramic submounts for high power and high brightness light emitting diodes (LEDs). Alumina (Al2O3) and aluminum nitride (AlN) ceramics are available. Multilayer alumina ceramic package with copper (Cu) heat slug is also available for high heat dissipation. Kyocera provides design engineering support for custom design products such as multi-chip module (MCM) packages. |
 Surface Mount Multilayer Ceramic Packages |
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Multilayer Alumina Ceramics (Aluminum Nitride Available) |
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Silver Plating Available for High Reflection |
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Small Size |
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Surface Mount |
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Aluminum Thin Film Available for High Reflection |
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Alumina (Al2O3) and Aluminum Nitride (AlN) Available |
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AlN Thermal Conductivity: 170, 200 or 230W/mK |
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0.5micron max. Surface Roughness for High Heat Dissipation |
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Gold Tin (AuSn) Thin Film Available for Chip Attach |
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Surface Mount Design Available |
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