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Ceramic Packages for Light Emitting Diodes (LEDs)
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Products > Semiconductor Components > Ceramic Packages for Light Emitting Diodes (LEDs)  Japanese

Ceramic Packages for Light Emitting Diodes (LEDs)

Kyocera uses alumina (Al2O3) and aluminum nitride (AlN) ceramics to produce multilayer packages and single-layer submounts for high-power, high-brightness light emitting diodes (LEDs). Multilayer alumina ceramic packages are available with a copper (Cu) heat slug for superior heat dissipation. Kyocera provides design engineering support for custom products, such as multi-chip module (MCM) packages.


 Surface-Mount Multilayer Ceramic Packages
Surface Mount Multilayer Ceramic Packages
· Multilayer alumina (Al2O3) or aluminum nitride (AlN) ceramic material
· Silver plating available for enhanced reflectance
· Small size
· Surface mount


 Thin-Film-Metallized Ceramic Submounts
Thin Film Submount
· Aluminum thin film available for enhanced reflectance
· Available in alumina (Al2O3) and aluminum nitride (AlN)
· AlN thermal conductivity: 170, 200 or 230W/mK
· 0.5micron max. surface roughness for high heat dissipation
· Gold-tin (AuSn) thin film available for chip attachment
· Surface-mount design available

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