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Products > Semiconductor Components > Ceramic Packages and Optics for Image Sensors

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Ceramic Packages and Optics for Image Sensors

Kyocera provides standard and custom design ceramic packages, optically coated glasses and chip assembly services for CCD and CMOS image sensors. Miniaturization of ceramic packages is possible due to the high-strength and high-rigidity of ceramic materials and the cavity structure it facilitates in ceramic packages. Ceramics are suitable for image sensors because of the low amount of dust produced from ceramics. Kyocera provides ceramic packages for infrared sensors and ultraviolet sensors.

Standard Products List (pdf/53KB)

Ceramic Leadless Chip Carriers (CLCC)						Ceramic Packages with Cavity for Passive Components

Optically Coated Glasses

CERDIP (C-DIP)

Glass Materials
·	Borosilicate Glass (Low alpha ray glass available)
·	Silica Glass etc.

Optical Coating
·	Anti-Reflection (AR) Coating
·	Infrared (IR) Cut Coating

CERDIP (C-DIP) Steatite Package (CTE:9.2ppm/K) Crystal Lid (CTE:8.0-13.4ppm/K) Sealing reliability of crystal lid is high.

·	Alumina package (CTE:7.1-7.3ppm/K) is recommended for borosilicate glass lid (CTE:7.2ppm/K).
·	Epoxy resin pre-coated glass is available.
·	Metal lid with glass window is available for hermetic sealing.
·	IR cut filter glass to a lens holder assembly (using epoxy resin) service is available.

Semiconductor Components