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Ceramic Packages and Optics for Image Sensors

Kyocera provides standard and custom-designed ceramic packages, optically coated glasses, and chip assembly services for CCD and CMOS image sensors. Ceramic materials facilitate miniaturization through their high strength, rigidity, and the cavity structures they make possible. Additionally, ceramic materials help avoid dust contamination during assembly processes, making them the ideal substrate for image sensor applications. Kyocera also provides ceramic packages for both infrared and ultraviolet sensors.


CCD: Charge-Coupled Device
CMOS: Complementary Metal Oxide Semiconductor

CERDIP: Ceramic Dual Inline Package
CTE: Coefficient of Thermal Expansion


Standard Products List  (pdf/53KB) PDF

Ceramic Leadless Chip Carriers (CLCC) Ceramic Packages with
Cavity for Passive Components
Ceramic Leadless Chip Carriers (CLCC) Ceramic Packages with Cavity for Passive Components
Ceramic Leadless Chip Carriers (CLCC) Image Sensor Solder Multilayer Ceramic Package Glass Lid Flexible Substrate Ceramic Packages with Cavity for Passive Components Image Sensor Multilayer Ceramic Package Cavity for Passive Components and ICs

Optically Coated Glasses CERDIP (C-DIP)
Optically Coated Glasses CERDIP (C-DIP)
Glass Materials
· Borosilicate Glass
(Low-alpha-radiation glass available)
· Silica Glass and others
Optical Coating
· Anti-Reflection (AR) Coating
· Infrared (IR) Cut Coating
CERDIP (C-DIP) Steatite Package (CTE:9.2ppm/K) Crystal Lid (CTE:8.0-13.4ppm/K) Sealing reliability of crystal lid is high.

· An alumina package (CTE: 7.1-7.3ppm/K) is recommended for borosilicate glass lid applications (CTE: 7.2ppm/K).
· Epoxy resin pre-coated glass is available.
· Metal lid with glass window is available for hermetic sealing.
· Assembly service is available for epoxy-mounting IR cut filters to lens holders.

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