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Image Sensor Components |
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| Kyocera provides standard and custom design ceramic packages, optically coated glasses and chip assembly services for CCD and CMOS image sensors. Size and height reduction of ceramic packages are feasible because ceramics have high strength and high rigidity and cavity structure can be made on ceramic packages. Ceramics are suitable for image sensors because few dusts are made from ceramics. Kyocera provides ceramic packages for infrared sensors and ultraviolet sensors, too. |
| Ceramic Leadless Chip Carriers (CLCC) |
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Ceramic Packages with
Cavity for Passive Components |
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| Optically Coated Glasses |
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CERDIP (C-DIP) |
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| Glass Materials |
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Borosilicate Glass
(Low alpha ray glass available) |
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Silica Glass etc. |
| Optical Coating |
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Anti-Reflection (AR) Coating |
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Infrared (IR) Cut Coating |
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Alumina package (CTE:7.3ppm/K) is recommended for borosilicate glass lid (CTE:7.2ppm/K). |
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Epoxy resin pre-coated glass is available. |
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Metal lid with glass window is available for hermetic sealing. |
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IR cut filter glass to a lens holder assembly (using epoxy resin) service is available. |
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