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Products > Semiconductor Components > Ceramic Packages and Optics for Image Sensors  Japanese

Ceramic Packages and Optics for Image Sensors

Kyocera provides standard and custom design ceramic packages, optically coated glasses and chip assembly services for CCD and CMOS image sensors. Miniaturization of ceramic packages is possible due to the high-strength and high-rigidity of ceramic materials and the cavity structure it facilitates in ceramic packages. Ceramics are suitable for image sensors because of the low amount of dust produced from ceramics. Kyocera provides ceramic packages for infrared sensors and ultraviolet sensors.


Standard Products List  (pdf/53KB) PDF

Ceramic Leadless Chip Carriers (CLCC) Ceramic Packages with
Cavity for Passive Components
Ceramic Leadless Chip Carriers (CLCC) Ceramic Packages with Cavity for Passive Components
Ceramic Leadless Chip Carriers (CLCC) Image Sensor Solder Multilayer Ceramic Package Glass Lid Flexible Substrate Ceramic Packages with Cavity for Passive Components Image Sensor Multilayer Ceramic Package Cavity for Passive Components and ICs

Optically Coated Glasses CERDIP (C-DIP)
Optically Coated Glasses CERDIP (C-DIP)
Glass Materials
· Borosilicate Glass
(Low alpha ray glass available)
· Silica Glass etc.
Optical Coating
· Anti-Reflection (AR) Coating
· Infrared (IR) Cut Coating
CERDIP (C-DIP) Steatite Package (CTE:9.2ppm/K) Crystal Lid (CTE:8.0-13.4ppm/K) Sealing reliability of crystal lid is high.

· Alumina package (CTE:7.1-7.3ppm/K) is recommended for borosilicate glass lid (CTE:7.2ppm/K).
· Epoxy resin pre-coated glass is available.
· Metal lid with glass window is available for hermetic sealing.
· IR cut filter glass to a lens holder assembly (using epoxy resin) service is available.

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